Product ID: 7032
3" Micro Cut Pad
- Open Cell Structure
- Allows for good handling & stability
- Light abrasive for fine scratches
- Hardness: 10
- Abrasive: 5
Koch-Chemie's Micro Cut Pad is a high-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie's M3/02 Micro Cut or P3/01 Micro Cut & Finish Polishing Compounds. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing.
The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.